Advanced Diamond Solutions Inc. -- News: LED, Semiconductor, Energy, Military Products Advanced Diamond


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Advanced Diamond News

Recent News Tidbits

  • May 28, 2010 - Advanced Diamond Solutions opens new R&D and sales office in Shanghai, China.
  • February 12, 2010 - Advanced Diamond Solutions releases new low cost LED packaging products, including advanced low temperature DLC coating and new diamond composite heat spreader solutions.
  • September 24, 2009 - Advanced Diamond Solutions and Kinik Company work together on new large area graphene products, developed using graphite and liquid phase manufacturing techniques. Mike Sung to present findings of new research at upcoming graphene conference.
  • May 15, 2009 - Advanced Diamond Solutions / Kinik-USA release new version of ODD - Organic Diamond Disk, a low cost CMP pad conditioner product made with epoxy and a reverse casting process, offering lower pricing than most competitors in the market.
  • February 3, 2009 - Advanced Diamond Solutions partners with Thermacore to test and deliver high thermal conductivity composites to the U.S. Army under a joint partnership SBIR Phase I Grant, with Thermacore as the primary grantee.
  • August 5, 2008 - Advanced Diamond Solutions has announced the opening of its San Francisco R&D Lab later this month, focused on the development of hybrid amorphous diamond-silicon solar cells, and CIGS based flexible solar cells. The lab will be focused on deposition of diamond, and characterization of solar cell efficiency.
  • October 15, 2007 - Advanced Diamond Solutions announces major 7-figure private investment, for its Advanced Diamond Energy project, to accelerate development of high efficiency amorphous diamond solar cells. The funding will allow ADS to expand its staff substantially, and candidates are encouraged to apply via our Contact page.
  • March 13, 2007 - Dr. Michael Sung of Advanced Diamond Solutions has presented breakthrough data at Asia Display 2007 in Shanghai, China , regarding our new amorphous diamond Field Emission Display technology. Amorphous diamond FED technology offers large surface areas with superior brightness, with proven technology, available for licensing.
  • January 20, 2007 - Advanced Diamond Solutions has released the latest version of ODD CMP conditioning disks, now available for testing by semiconductor companies, with universal mounts. This new conditioning disk offers lower unit costs than electroplated disks, while still maintaining rigidity and cut rate.
  • August 20, 2006 - Advanced Diamond Solutions Inc., as part of its ongoing grant for the USAF AFRL, presents new data on the success of dielectric based solar cells, using amorphous diamond solar technology. This new technology offers high efficiencies at a much lower cost than vacuum based versions, as well as improved "ruggedization" for military applications.
  • April 13, 2006 - Advanced Diamond Solutions Inc. presents its groundbreaking new data on PCD pad conditioners at the CMPUG Conference in Sunnyvale, California. Proceedings available here
  • March 15, 2006 - Advanced Diamond Solutions Inc. announces that the US Air Force has issued notice that it intends to award Advanced Diamond Solutions, Inc. a SBIR (Small Business Innovation Research) Phase I Grant for research on high efficiency amorphous diamond solar cells, with work planned in conjunction with the AFRL Research Laboratories. ADS will use the SBIR Phase I grant to develop a prototype for use in high bandwidth satellite application.
  • October 7, 2005 - Advanced Diamond Solutions Inc. announces that it is marketing two innovative new pad conditioner products ADD with a substrate made from polycrystalline diamond and ODD, made from epoxy; information is available on our product page.
  • April 27, 2005 - Advanced Diamond Solutions Inc. wins Ignite Energy Award for developing a clean energy product using amorphous diamond, under the brand Advanced Diamond Energy. This new technology uses diamond to generate solar-to-energy conversion efficiencies of up to 50%.
  • February 27, 2005 - Advanced Diamond Solutions Inc. announces the acquisition of P1 Diamond, Inc, a 10-year old CVD diamond innovation company in Santa Clara, California, originally funded by Intel Corporation, acquired from Adams Capital Management.
  • November 20, 2004 - Advanced Diamond Solutions Inc. announces new product line DiaAl, a molded diamond-aluminum composite offering more extensibility in thickness and dimension. DiaAl will be characterized over the next 6 months.
  • August 15, 2004 - Advanced Diamond Solutions Inc. announces final qualification of production plant for new, larger sized pieces, up to 90mm in diameter.
  • July 7, 2004 - Advanced Diamond Solutions Inc. has released a new version of DiaCu offering Ag filler, permitting enhanced flatness direct from the press.
  • March 31, 2004 - Advanced Diamond Solutions Inc. announces 3 new customers of its DiaCu product line this month, and 500% quarter over quarter booked revenue growth as of the end of Q1,2004 today.
  • February 20, 2004 - ADS now carries a new, more advanced gradient version of its DiaCu-II product line, offering higher thermal conductivity (~1,800 W/mK through thickness) and improved multi-layer spreading over existing products.
  • December 4, 2003 - Advanced Diamond Solutions Inc. won the Massachusetts Institute of Technology (MIT) 1K award for Materials Science, for its innovative diamond-based thermal management solutions; a RealMedia version of the brief speech can be found at http://50k.mit.edu.
  • November 25, 2003 - ADS announces as of this month 2 Fortune 100 companies have entered into research projects for future CPU heat spreaders involving Advanced Diamond Solutions' DiaCu line.
  • October 22, 2003 - Advanced Diamond Solutions Inc. releases breakthrough new product line, Heathru DiaPaste, a diamond-based thermal interface material (TIM) that removes the resistance bottleneck from the die to the spreader in cases where soldering is not feasible. HeaThru DiaPaste offers superior thermal conductivity to Aluminum, Silver and Ceramic particle filled pastes, allowing the maximally effective use of its complementary product lines, DiaCu and DiaSil.
  • September 10, 2003 - Advanced Diamond Solutions Inc. announces new pressing process, allowing disc sizes up to 95mm in diameter.
  • July 1, 2003 - Advanced Diamond Solutions Inc. announces the release of DiaCu-II, the most recent generation of the HeaThru product family, with approximately 30% performance improvement over DiaCu-1 and up to 50.8 mm diameter geometries.
  • June 12, 2003 - Advanced Diamond Solutions Inc. announces that Northrop Grumman, the US' second largest defense contractor, has purchased custom versions of DiaCu-1 for preliminary testing as an advanced heat spreader material.
  • May 15, 2003 - Advanced Diamond Solutions Inc. announces the release of its second product line, DiaCu-I, a diamond-copper composite with twice the thermal conductivity of copper.  Independent research institutions have verified the thermal performance of this material.
  • March 17, 2003 - TetraThermal (Now Advanced Diamond Solutions Inc.) announces the release of DiaSil-I, the first product line in the HeaThru thermal products family.  DiaSil is a diamond-silicon composite with copper-grade thermal conductivity and silicon-compatible thermal expansion coefficient.
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