Advanced Diamond Solutions Inc., is a world leader in the research & development of industrial diamond products, including CMP pad conditioners, DLC / amorphous diamond thermoelectric / photovoltaic products, CVD / PVD coatings, diamond composite thermal management products, ZRN and other diamond-like ceramics, CBN & diamond grit products, nanodiamond biotechnology products, diamond based LED and other lighting sources, high pressure cell technologies, jewelry class diamond products, graphene products and more. ADS also continues to develop technologies conceived by Santa Clara, CA CVD Diamond innovator P1 Diamond, Inc., which was acquired by and merged with ADS in 2005. Below, you can find a sampling of whitepapers & research papers about some of our most popular products. For more information about these products, or our other product offerings, please contact us here.
NOTE: In order to see the whitepapers above, you will need Adobe Acrobat Reader
MORE ABOUT OUR POPULAR HEATHRU DIAMOND COMPOSITES TECHNOLOGY:
Researchers at Advanced
Diamond Solutions Inc. have successfully created a low-cost diamond-copper
composite material called Heathru, with immediate thermal management
applications for semiconductor devices with high power densities.
With thermal conductivities demonstrated over twice that of copper, the
material will have dramatic impacts in the microprocessor, memory/graphics,
optoelectronics, and power electronics industries, where power dissipation
concerns are paramount.
Heat has become the
most critical issue in computer and semiconductor design in recent years.
The semiconductor industry has consistently followed Moore’s Law, which
states that the number of transistors within semiconductor chips doubles every
18 months since the beginning days of modern semiconductor manufacturing.
As the same time, the size of transistors are getting smaller, resulting
in as increase in the number of transistors packed into a given area.
This, combined with the inexorable increase in the clock speed of running
such devices, results in skyrocketing power densities in modern day devices such
as microprocessors and other high-performance chips. As Intel CTO Patrick Gelsinger prognosticated, the
semiconductor industry is “heading for a meltdown,” with the trend of power
densities of modern microprocessors literally escalating toward levels found
within a nuclear reactor over the next few years.
The main problem boils
down to basic material science. A
material’s thermal conductivity is the core property that determines its
ability to efficiently conduct heat away from a power source.
Most modern high-end semiconductor devices have made the move to copper
as the material of choice to transfer heat away since it has one of the highest
thermal conductivities any metal (silver is the only metal with a slightly
higher conductivity, but is cost-prohibitive for most applications).
Unfortunately, copper has already started to become a bottleneck in
removing heat from semiconductor devices.
Diamond, on the other
hand, has always been considered a miracle material, being both the hardest
known material as well as having the highest thermal conductivity, estimated to
be around 6 times that of copper. However,
even with such superlative heat transfer characteristics, diamond has
historically been limited in commercial scope because of the associated cost in
producing the material. In fact,
only in specialty markets such as heat spreaders for laser diodes has diamond
established itself as a viable solution.
Solutions Inc. has perfected a proprietary process for producing a high-quality
diamond-copper composite material that retains a lot of the thermal properties
of diamond, but at an order of magnitude cost reduction over conventional
diamond manufacturing processes such as chemical vapor deposition (CVD).
By using conventional diamond synthesis technology, Advanced Diamond is able to
create a low-cost sintered diamond composite, with the ability to tailor the
exact diamond and filler content to dovetail with the thermal specifications of
the device it is to be attached to. In
addition, Advanced Diamond can create very large geometries not physically
possible with CVD, currently up to over 3 mm in thickness, 50 mm diameter wafers
with 90 mm diameter wafers available in the near future.
In addition to bulk
thermal conductivity, engineers in semiconductor packaging are also extremely
concerned about the thermal expansion rate of a material.
If the thermal expansion rates of a thermal transfer material is not
properly matched to the device’s semiconductor substrate, micro-cracking will
occur at the interface between the two materials as the device is turned on and
off, resulting in reliability problems and reducing the life-time of the device.
Since copper and other metals exhibit thermal expansion rates that are an
order of magnitude that of silicon and gallium arsenide, it is problematic to
attach these materials to semiconductor chips.
In fact, many packaging solutions sacrifice on thermal conductivity,
choosing less efficient heat conductors such as ceramics in order to address
this issue. On the other hand,
since Advanced Diamond’s Heathru products are made primarily of diamond, its
thermal expansion rate is very semiconductor-compatible.
In addition, Advanced Diamond can tightly control the exact thermal
expansion rate of its material by varying the diamond content of the diamond
through our patent-pending process, making it particularly easy to engineer a
thermal solution to match a particular semiconductor device.
For more information on our processes and technology, please contact us via our web contact form. Please click here for more info...